Media and Resources
In the previous issue, we introduced the temperature and humidity reliability test on 5G universal module. In practice, since 5G modules will be principally used in industrial applications, they must deal with a range of harsh environments. In addition to temperature and humidity test, it's essential to perform tests on dust & mist reliability, mechanical reliability, electrical reliability, etc.
Reliability test is performed to evaluate the functional reliability of 5G modules in all expected environments of operation, transport or storage within their specified life spans, thereby analyzing the module performance.
Dust & Mist Reliability Test
Ø Salt spray test: Verify DUT's resistance to salt sprays pollutants in the atmosphere. The standard test environment is restored after the prescribed harsh environment; in the standard test environment, the appearance and performance test of DUT shall comply with relevant requirements.
Ø Sand Dust Test：Terminal devices with enclosure protection class IP code whose second characteristic number is larger than 0 shall withstand waterproofing tests of specified level.
Ø Waterproofing test: Terminal devices with enclosure protection class IP code whose second characteristic number is larger than 0 shall withstand waterproofing tests of specified level.
Ø Salt spray cycle test: Simulate the operating state of DUT without power supply in the prescribed environments with salt spray and temperature and humidity; for example, industry terminal-oriented 5G universal modules are stored and kept in environmental conditions where salt spray reacts with moisture. The performance test and visual inspection of DUT shall meet requirements in the environments of prescribed severity level.
Mechanical Reliability Test
Ø Sinusoidal vibration test: Verify the resistances of DUT solder joints to the interconnection failure resulting from vibration during transport and operation. The tests on appearance, structure and performance of DUT shall meet requirements in the environments of prescribed severity level.
Ø Broad-band random vibration test: Simulate the exposure of DUT to the operating state with broad-band random vibration; for instance, the DUT performance test shall meet requirements when industry terminal-oriented 5G universal modules are used for environments or devices with broad-band random vibration.
Ø Free drop test: Simulate DUT drop during transport, handling and other operations to verify the adaptability of industry terminal-oriented 5G universal modules for drop.
Ø Impact test: Simulate the effects of non-repetitive impacts that DUT undergoes; simulate the effects of road impact and other mechanical impacts on product failure.
Ø Crash test: Simulate the resistance of DUT to repetitive impacts during operation and transport. DUT performance tests in the conditions of prescribed severity level shall comply with relevant requirements. The severity level of crash test is dependent on peak acceleration, nominal pulse duration, and number of collisions.
Ø The operating performance of DUT shall meet specified performance requirements after tests. No damage to appearance and no fracture and anomalies of physical connections develop after the specified tests; the module functions properly in all aspects.
SIMCom's 5G Modules
SIMCom's 5G modules are equipped with the Qualcomm X55 platform. After the initially launched SIM8200EA-M2 with M.2 standard package in 2019, SIMCom successively launched millimeter wave-compatible SIM8300G-M2, LGA-packed SIM8200G, and the latest ultra-small sized module SIM8202G-M2. Compatible with a variety of communication protocols, the SIMCom 5G modules support NSA/SA networking and cover the network frequency bands of major global operators; thanks to their excellent scalability and rich interfaces, they are extensively applicable for virtual reality, augmented reality, CPE and other demand terminals, and are competent to create application scenarios of Internet of Vehicles, Industrial IoT, smart healthcare, 4k/8K HD video, etc., thereby facilitating the intelligent interconnection of all things.