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Shenzhen, China – April 23, 2026 – Tuya Smart (NYSE: TUYA; HKEX: 2391), a premier global AI cloud platform service provider, and SIMCom Wireless Solutions Limited (SIMCom), a global pioneer in wireless communication modules, officially announced a deep partnership today. By leveraging a synergistic "Connectivity + AI + Cloud" model to break down technical barriers between hardware and software, the two industry leaders are launching a one-stop AIoT solution. This collaboration is designed to reduce operational costs, enhance efficiency, and unlock the full potential of IoT across global commercial sectors.
Synergistic Growth through Hardware-Software Integration
The strategic cooperation agreement was officially signed during the 2026 Tuya Global Developer Conference. Leo Chen, Co-Chairman and President of Tuya Smart, and Steven Yuan, General Manager of SIMCom, attended the ceremony. The agreement was signed by Xiuqing Shen, Senior Product Manager of the Mobility Business Unit at Tuya Smart, and Qianhuai Deng, Executive Assistant to the General Manager and the General Manager of the Partnership Department at SIMCom. This collaboration marks a decisive move to empower the global AI+IoT commercial landscape, garnering significant attention from developers and industry partners worldwide.
Tuya Smart continues to lead the "AI for Life" vision by lowering development barriers through its TuyaOpen open-source framework and robust AI Agent engines. By embedding multi-modal AI capabilities, Tuya streamlines the transition from digital intelligence to physical reality.
Complementing this, SIMCom brings over 20 years of leadership in wireless technology. Its comprehensive portfolio—covering all cellular standards and platforms, including industrial-grade and automotive-grade modules—combined with global certification and delivery capabilities, serves as the essential hardware foundation for large-scale IoT deployments.
Accelerating Global AIoT Deployment: A One-Stop Paradigm
This partnership represents a profound integration of "Hardware + Software + Cloud Services". While Tuya Smart provides the "Intelligent Brain" and "Cloud Steward" via its AI large models, SIMCom provides the vital "Communication Bridge" through its advanced modules.
By pre-optimizing technical compatibility, the collaboration eliminates the integration complexities for downstream enterprises. This "one-stop" approach significantly:
• Slashes R&D and deployment costs.
• Lowers entry barriers for complex AIoT projects.
• Accelerates Time-to-Market, enabling businesses to launch and scale smart products globally with unprecedented speed.
The collaboration focuses on high-growth sectors, including AI toys, robotics, asset tracking, smart energy, and wearables. By driving intelligent upgrades in these fields, the partnership allows developers to focus on what matters most: product innovation.
"The evolution of Generative AI is bringing smarter, more intuitive user experiences to hardware and smart home devices," said Zheyuan Nie, Chief Hardware Embedded Architect at Tuya Smart. " Combining Tuya’s robust global AIoT platform with SIMCom’s two decades of leadership in wireless technology, this partnership fosters deep technical synergy and ecosystem integration. Together, we are committed to providing premium, one-stop solutions that empower global enterprises and spearhead the high-quality advancement of the AI+IoT landscap.”
Steven Yuan, General Manager of SIMCom, noted: " As the demand for AI surges, customers are seeking efficient and reliable integrated AIoT solutions. With over 20 years of expertise in wireless communication, SIMCom’s full-standard modules are market-proven and represent our core technical strength. Through this partnership with Tuya Smart, we aim to leverage our combined technical advantages to achieve pre-integrated, full-link adaptation. By eliminating the complexities of technical interfacing, we empower our customers to seize AI opportunities rapidly, accelerate product intelligence, and achieve global deployment, ultimately creating tangible, long-term value.”
This collaboration and the high-profile signing ceremony mark a pivotal milestone in the joint layout of the AI+IoT ecosystem. By synergizing core competencies, SIMCom and Tuya Smart will deepen the integration of hardware, software, and AI connectivity. This partnership is set to catalyze innovative scenarios, dismantle industry barriers, and accelerate the realization of the Intelligence of Everything, ultimately driving the collaborative evolution of the global AIoT industry.
About Tuya Smart
Tuya Inc. (NYSE: TUYA; HKEX: 2391) is a leading global AI cloud platform service provider dedicated to bringing AI into everyday life. Through its TuyaOpen open-source development framework and universal AI Agent engines, including the AI Agent development platform, Tuya integrates multimodal AI capabilities to lower barriers for AI development, efficiently advancing the realization of AI-driven lifestyles and accelerating AI integration with the physical world. Tuya offers innovative physical AI solutions for smart devices, commercial applications, and industry developers through its cloud computing and spatial intelligence capabilities. It also provides a complete, open, and neutral global AIoT ecosystem. This approach fosters a vibrant global developer community comprising brands, OEMs, AI agents, system integrators, and independent software vendors who collaborate to create smart solution ecosystems embodying the principles of sustainability, security, efficiency, agility, and openness.
About SIMCom
SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G, 4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.
SIMCom insists on providing high-quality modules and industry solutions. With more than 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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